The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Jun. 16, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Arzum F. Simsek-Ege, Boise, ID (US);

Guangjun Yang, Meridian, ID (US);

Kuo-Chen Wang, Tokyo, JP;

Mohd Kamran Akhtar, Boise, ID (US);

Katsumi Koge, Tokyo, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/24 (2006.01); H01L 27/108 (2006.01); H01L 21/764 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10855 (2013.01); G11C 11/4087 (2013.01); H01L 21/764 (2013.01); H01L 27/10814 (2013.01); H01L 27/10873 (2013.01); G11C 11/4091 (2013.01);
Abstract

A semiconductor device comprises semiconductive pillars; digit lines laterally between the semiconductive pillars; nitride caps vertically overlying the digit lines; nitride structures overlying surfaces of the nitride caps; redistribution material structures comprising upper portions overlying upper surfaces of the nitride caps and the nitride structures, and lower portions overlying upper surfaces of the semiconductive pillars; a low-K dielectric material laterally between the digit lines and the semiconductive pillars; air gaps laterally between the low-K dielectric material and the semiconductive pillars, and having upper boundaries below the upper surfaces of the nitride caps; and a nitride dielectric material laterally between the air gaps and the semiconductive pillars. Memory devices, electronic systems, and method of forming a semiconductor device are also described.


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