The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Dec. 18, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hung-Jui Kuo, Hsinchu, TW;

Hui-Jung Tsai, Hsinchu, TW;

Keng-Han Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/687 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/68721 (2013.01); G01R 31/2889 (2013.01); G01R 31/2893 (2013.01);
Abstract

A workpiece holding mechanism, a process system and a manufacturing method of a semiconductor structure are provided. The workpiece holding mechanism is used in a vacuum chamber, and includes a stage, a platen and a workpiece clamper. The platen is disposed over the stage, and configured to support a workpiece. The workpiece clamper is standing on the stage, and configured to clamp the workpiece from above the workpiece. The workpiece clamper includes a plurality of supporting elements and an elevated structure. The supporting elements are connected between the stage and the elevated structure. The platen is surrounded by the supporting elements. The elevated structure is configured to physically contact a peripheral region of the workpiece from above the workpiece.


Find Patent Forward Citations

Loading…