The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Sep. 25, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Brandon C Marin, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Sameer Paital, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/1163 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13026 (2013.01);
Abstract
Disclosed embodiments include a catalyst-doped mold interconnect system, where activated catalyst particles that line via and trace corridors, are used for electroless-plating formation of both liners and vias and traces that also electrolessly plate onto the liners. Photolithographically formed interconnects can be mingled with laser-ablation form-factor vias and traces within a single stratum of a catalyst doped mold interconnect system.