The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Oct. 04, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shawna M. Liff, Scottsdale, AZ (US);

Adel A. Elsherbini, Chandler, AZ (US);

Sasha N. Oster, Chandler, AZ (US);

Feras Eid, Chandler, AZ (US);

Georgios C. Dogiamis, Chandler, AZ (US);

Thomas L. Sounart, Scottsdale, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/04 (2006.01); H04L 12/24 (2006.01); H01H 57/00 (2006.01); H01L 41/047 (2006.01); H01L 41/187 (2006.01); A61B 5/0205 (2006.01); A61B 5/00 (2006.01); H01L 41/09 (2006.01); A61B 5/024 (2006.01); A61B 5/021 (2006.01); A61B 5/08 (2006.01); A61B 5/145 (2006.01); H01H 37/00 (2006.01);
U.S. Cl.
CPC ...
H04L 41/0816 (2013.01); A61B 5/02055 (2013.01); A61B 5/7282 (2013.01); A61B 5/7285 (2013.01); H01H 57/00 (2013.01); H01L 41/0471 (2013.01); H01L 41/094 (2013.01); H01L 41/187 (2013.01); H01L 41/1873 (2013.01); H01L 41/1876 (2013.01); H04L 41/0886 (2013.01); A61B 5/021 (2013.01); A61B 5/02405 (2013.01); A61B 5/08 (2013.01); A61B 5/145 (2013.01); A61B 5/4266 (2013.01); A61B 5/4824 (2013.01); A61B 2560/0462 (2013.01); H01H 2037/008 (2013.01); H01H 2057/006 (2013.01);
Abstract

Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.


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