The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Jul. 17, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Zhongxin Wen, Tokyo, JP;

Nobuyuki Takahashi, Tokyo, JP;

Suguru Sakugawa, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/46 (2006.01); B24B 37/005 (2012.01); B24B 49/08 (2006.01); B24B 37/04 (2012.01); B08B 3/02 (2006.01); H01L 21/67 (2006.01); B08B 5/02 (2006.01); H01L 21/687 (2006.01); B24B 7/22 (2006.01); G01D 5/42 (2006.01);
U.S. Cl.
CPC ...
G01D 5/46 (2013.01); B08B 3/022 (2013.01); B08B 5/023 (2013.01); B24B 7/228 (2013.01); B24B 37/005 (2013.01); B24B 37/04 (2013.01); B24B 49/08 (2013.01); H01L 21/67051 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/68742 (2013.01); B08B 2203/02 (2013.01); G01D 5/42 (2013.01);
Abstract

A polishing device has a substrate stage which holds a substrate Wf, a processing head which processes a surface of the substrate Wf, an indentation detecting system which detects a position of an indentation in the substrate Wf, a movement mechanism which moves the processing head in a radial direction of the substrate stage, and a rotation mechanism which rotates the substrate stage, and the indentation detecting system has a fluid injection nozzle configured to inject a fluid to a circumferential edge portion of the substrate Wf when the substrate Wf is held on the substrate stage, a fluid measuring device which measures a physical quantity which is pressure or a flow rate of the fluid, and a position detector which detects the position of the indentation formed in the circumferential edge portion of the substrate Wf based on a change in physical quantity.


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