The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Jun. 27, 2018
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Rahul Sharangpani, Fremont, CA (US);

Raghuveer S. Makala, Campbell, CA (US);

Fei Zhou, San Jose, CA (US);

Adarsh Rajashekhar, Santa Clara, CA (US);

Tatsuya Hinoue, Yokkaichi, JP;

Tomoyuki Obu, Yokkaichi, JP;

Tomohiro Uno, Yokkaichi, JP;

Yusuke Mukae, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 23/532 (2006.01); H01L 27/11556 (2017.01); H01L 29/49 (2006.01); H01L 21/768 (2006.01); H01L 27/11582 (2017.01); H01L 27/11524 (2017.01); H01L 27/11529 (2017.01); H01L 27/1157 (2017.01); H01L 27/11573 (2017.01); H01L 27/11519 (2017.01); H01L 27/11565 (2017.01);
U.S. Cl.
CPC ...
H01L 23/53266 (2013.01); H01L 21/76846 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01); H01L 27/11556 (2013.01); H01L 27/11573 (2013.01); H01L 27/11582 (2013.01); H01L 29/4966 (2013.01); H01L 27/11519 (2013.01); H01L 27/11565 (2013.01);
Abstract

A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate and memory stack structures extending through the alternating stack. Each of the electrically conductive layers includes a stack of a compositionally graded diffusion barrier and a metal fill material portion, and the compositionally graded diffusion barrier includes a substantially amorphous region contacting the interface between the compositionally graded diffusion barrier and a substantially crystalline region that is spaced from the interface by the amorphous region. The substantially crystalline region effectively blocks atomic diffusion, and the amorphous region induces formation of large grains during deposition of the metal fill material portions.


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