The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

May. 07, 2019
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Ramasamy Chockalingam, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Wanbing Yi, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01);
Abstract

A device and methods for forming the device is provided. The device includes a substrate and circuit elements thereon. The device further includes a metallization layer over the substrate. The metallization layer includes interconnects interconnecting the circuit elements. A test pad is disposed over an uppermost interconnect in the metallization layer. The test pad is coupled to one or more circuit elements via the interconnects. The test pad is configured for testing the one or more circuit elements. A crack stop protection seal surrounding the test pad is provided. The crack stop protection seal confines damage caused by probing at the test pad from propagating to an area beyond the crack stop protection seal.


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