The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 06, 2018
Applicant:

Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;

Inventors:

Yenheng Chen, Jiangyin, CN;

Chengtar Wu, Jiangyin, CN;

Jangshen Lin, Jiangyin, CN;

Chengchung Lin, Jiangyin, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01Q 21/06 (2006.01); H01Q 1/36 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01Q 1/36 (2013.01); H01Q 1/38 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/061 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01);
Abstract

The present disclosure provides a method making a semiconductor structure with an antenna module. The semiconductor structure includes an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module is disposed on the first surface of the antenna substrate; and a redistribution layer is disposed on the second surface of the antenna substrate. The method of making the semiconductor structure with the antenna includes fabricating the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.


Find Patent Forward Citations

Loading…