The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Jul. 01, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wei-Chun Tan, New Taipei, TW;

I-Hsieh Wong, Hsinchu, TW;

Te-En Cheng, Taoyuan, TW;

Yung-Hui Lin, New Taipei, TW;

Wei-Ken Lin, Tainan, TW;

Wei-Yang Lee, Taipei, TW;

Chih-Hung Nien, Changhua, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 29/16 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 21/306 (2006.01); H01L 21/8238 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/308 (2006.01); H01L 21/3115 (2006.01); H01L 21/3065 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 21/027 (2006.01); H01L 21/762 (2006.01); H01L 21/266 (2006.01); H01L 29/36 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823821 (2013.01); H01L 21/0206 (2013.01); H01L 21/02126 (2013.01); H01L 21/02532 (2013.01); H01L 21/26513 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/31155 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823864 (2013.01); H01L 29/0847 (2013.01); H01L 29/66545 (2013.01); H01L 21/0228 (2013.01); H01L 21/0276 (2013.01); H01L 21/266 (2013.01); H01L 21/76224 (2013.01); H01L 21/823878 (2013.01); H01L 29/36 (2013.01);
Abstract

A method includes forming a first fin extending from a substrate, forming a first gate stack over and along sidewalls of the first fin, forming a first spacer along a sidewall of the first gate stack, the first spacer including a first composition of silicon oxycarbide, forming a second spacer along a sidewall of the first spacer, the second spacer including a second composition of silicon oxycarbide, forming a third spacer along a sidewall of the second spacer, the third spacer including silicon nitride, and forming a first epitaxial source/drain region in the first fin and adjacent the third spacer.


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