The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Oct. 31, 2019
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Cheng-Lin Ho, Kaohsiung, TW;
Chih-Cheng Lee, Kaohsiung, TW;
Chun Chen Chen, Kaohsiung, TW;
Yuanhao Yu, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.