The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Dec. 15, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yi Song, Albany, NY (US);

Jay W. Strane, Warwick, NY (US);

Eric Miller, Watervliet, NY (US);

Fee Li Lie, Albany, NY (US);

Richard A. Conti, Katonach, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 21/308 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/3115 (2006.01); H01L 29/06 (2006.01); H01L 21/3105 (2006.01); H01L 27/092 (2006.01); H01L 21/027 (2006.01); H01L 29/10 (2006.01); H01L 21/311 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823821 (2013.01); H01L 21/0217 (2013.01); H01L 21/0276 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/31053 (2013.01); H01L 21/31155 (2013.01); H01L 21/823807 (2013.01); H01L 21/823892 (2013.01); H01L 27/0924 (2013.01); H01L 27/0928 (2013.01); H01L 29/0673 (2013.01); H01L 29/1095 (2013.01); H01L 29/6656 (2013.01); H01L 21/31111 (2013.01); H01L 21/823885 (2013.01); H01L 27/092 (2013.01); H01L 29/66666 (2013.01); H01L 29/78642 (2013.01);
Abstract

A finned semiconductor structure including sets of relatively wide and relatively narrow fins is obtained by employing hard masks having different quality. A relatively porous hard mask is formed over a first region of a semiconductor substrate and a relatively dense hard mask is formed over a second region of the substrate. Patterning of the different hard masks using a sidewall image transfer process causes greater lateral etching of the relatively porous hard mask than the relatively dense hard mask. A subsequent reactive ion etch to form semiconductor fins causes relatively narrow fins to be formed beneath the relatively porous hard mask and relatively wide fins to be formed beneath the relatively dense hard mask.


Find Patent Forward Citations

Loading…