The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Apr. 15, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Koichi Motoyama, Clifton Park, NY (US);

Oscar van der Straten, Guilderland Center, NY (US);

Kenneth Chun Kuen Cheng, Albany, NY (US);

Joseph F. Maniscalco, Lake Katrine, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/5283 (2013.01); H01L 23/53238 (2013.01);
Abstract

An interconnect structure of an integrated circuit (IC) in which dielectric material defines upper and lower cavities and a via cavity communicative with the upper and lower cavities at upper and lower ends thereof. The interconnect structure includes first conductive material filling the upper and lower cavities to form upper and lower lines, respectively and second conductive material filling the via cavity from the upper end thereof to the lower end thereof to form a via electrically communicative with the upper and lower lines.


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