The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Mar. 03, 2016
Applicants:

Core Technology, Inc., Iruma, JP;

Askagi Corporation, Fukuoka, JP;

Inventors:

Toshiaki Yoshimura, Iruma, JP;

Hiroyuki Minowa, Iruma, JP;

Lung Kei Amos Shek, Iruma, JP;

Assignees:

CORE TECHNOLOGY, INC., Saitama, JP;

ASKAGI CORPORATION, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4583 (2013.01); C23C 16/50 (2013.01); H01J 37/32715 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Provided is a substrate tray which is to be used in a thin-film formation device and makes it easy to improve film quality and film thickness uniformity on a substrate by improving substrate heating efficiency and substrate heating uniformity. Thus, a substrate tray to be used in a thin-film formation device and characterized in that: wherein there are formed substrate mountable spaces each of which substantially corresponds to a substrate shape by installing partition frames arranged in matrix each of which has a substantial quadrangular frame shape within an outer frame and by partitioning inside of the outer frame in a grid, wherein a plurality of wires are installed between front and rear side frames mutually opposing within the outer frame and each partition frame is connected and supported by the wires, and wherein the substrate is mountable on a substrate support portion of a lower partition frame joined to a bottom surface of an upper partition frame in the partition frame or on the wires crossing the substrate mountable spaces.


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