The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jun. 16, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yu-Hao Tsai, Albany, NY (US);

Du Zhang, Albany, NY (US);

Mingmei Wang, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30621 (2013.01); H01L 21/31055 (2013.01);
Abstract

A method for selective etching of silicon oxide relative to silicon nitride includes exposing a substrate to a first gas that forms a first layer on the silicon oxide film and a second layer on the silicon nitride film, where the first gas contains boron, aluminum, or both boron and aluminum, exposing the substrate to a nitrogen-containing gas that reacts with the first layer to form a first nitride layer on the silicon oxide film and reacts with the second layer to form a second nitride layer on the silicon nitride film, where a thickness of the second nitride layer is greater than a thickness of the first nitride layer. The method further includes exposing the substrate to an etching gas that etches the first nitride layer and silicon oxide film, where the second nitride layer protects the silicon nitride film from etching by the etching gas.


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