The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2021
Filed:
Sep. 30, 2020
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Igor Elkanovich, Hsinchu, TW;
Amnon Parnass, Hsinchu, TW;
Pei Yu, Hsinchu, TW;
Li-Ken Yeh, Hsinchu, TW;
Yung-Sheng Fang, Hsinchu, TW;
Sheng-Wei Lin, Hsinchu, TW;
Tze-Chiang Huang, Hsinchu, TW;
King Ho Tam, Hsinchu, TW;
Ching-Fang Chen, Hsinchu, TW;
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An interface for a semiconductor device includes a master device and a plurality of slave devices. The interface includes a master interface and a slave interface. The master interface is implemented in the master device and includes a master bond pattern of master bonds arranged as a first array. The slave interface is implemented each slave device and includes a slave bond pattern of slave bonds arranged as a second array. The first array of the master bonds includes a first central row and first data rows in two parts being symmetric to the first central row. The second array of the slave bonds includes a second central row and second data rows in two parts being symmetric to the second central row. The first central row and the second central row are aligned in connection, and the first data rows are connected to the second data rows.