The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Dec. 07, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Patrick Morrow, Portland, OR (US);

Mauro J. Kobrinsky, Portland, OR (US);

Mark T. Bohr, Aloha, OR (US);

Tahir Ghani, Portland, OR (US);

Rishabh Mehandru, Portland, OR (US);

Ranjith Kumar, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/02 (2006.01); H01L 21/306 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 29/417 (2006.01); H01L 29/772 (2006.01); H01L 23/522 (2006.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); H01L 21/30604 (2013.01); H01L 21/768 (2013.01); H01L 21/76898 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/823475 (2013.01); H01L 23/522 (2013.01); H01L 27/0207 (2013.01); H01L 27/088 (2013.01); H01L 27/0886 (2013.01); H01L 29/0847 (2013.01); H01L 29/1095 (2013.01); H01L 29/401 (2013.01); H01L 29/4175 (2013.01); H01L 29/41791 (2013.01); H01L 29/66636 (2013.01); H01L 29/66795 (2013.01); H01L 29/772 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01);
Abstract

Integrated circuit (IC) cell architectures including a crenellated interconnect trace layout. A crenellated trace layout may be employed where an IC cell includes transistor having a source/drain terminal interconnected through a back-side (3D) routing scheme that reduces front-side routing density for a given transistor footprint. In the crenellated layout, adjacent interconnect traces or tracks may have their ends staggered according to a crenellation phase for the cell. Crenellated tracks may intersect one cell boundary with adjacent tracks intersecting an opposite cell boundary. Track ends may be offset by at least the width of an underlying orthogonal interconnect trace. Crenellated track ends may be offset by the width of an underlying orthogonal interconnect trace and half a spacing between adjacent orthogonal interconnect traces.


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