The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Oct. 30, 2017
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chun-Liang Tai, Hsinchu, TW;
Chun-Hsiang Fan, Hsinchu, TW;
Kuo-Bin Huang, Jhubei, TW;
Ming-Hsi Yeh, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B05D 1/00 (2006.01); B05D 3/00 (2006.01); B08B 3/10 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); B05B 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B05B 3/02 (2013.01); B05D 1/002 (2013.01); B05D 3/007 (2013.01); B08B 3/10 (2013.01); H01L 21/02057 (2013.01); H01L 21/67034 (2013.01); H01L 21/67103 (2013.01); H01L 21/68728 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01);
Abstract
A method of processing a semiconductor substrate is provided. The semiconductor substrate may be placed on a spin chuck with a plurality of holding members, each holding member including a pin having a sloped portion to provide a gap between an upper edge of the substrate and the pin. Thereafter, one or more treatment fluids may be dispensed over the substrate.