The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Nov. 10, 2019
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventors:

Qiguang Wang, Wuhan, CN;

Lei Jin, Wuhan, CN;

An Zhang, Wuhan, CN;

Jianwei Lu, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 21/28 (2006.01); C23C 28/04 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 27/1157 (2017.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); C23C 28/042 (2013.01); H01L 21/0223 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 27/1157 (2013.01); H01L 29/40117 (2019.08); H01L 29/4234 (2013.01); H01L 29/42368 (2013.01);
Abstract

A three-dimensional (3D) memory device and a manufacturing method thereof are provided. The method includes the following steps. An alternating dielectric stack is formed on a substrate. An opening is formed penetrating the alternating dielectric stack in a thickness direction of the substrate. A blocking layer is formed on a sidewall of the opening. A trapping layer is formed in the opening, and the trapping layer is formed on the blocking layer. The trapping layer includes a lower portion and an upper portion disposed above the lower portion. A thickness of the upper portion in a horizontal direction is greater than a thickness of the lower portion in the horizontal direction. The thickness distribution of the trapping layer is modified for improving the electrical performance of the 3D memory device.


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