The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Aug. 09, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Lijiang Wang, Chandler, AZ (US);

Jianyong Xie, Chandler, AZ (US);

Sujit Sharan, Chandler, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01P 3/088 (2013.01); H01P 11/003 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6638 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19031 (2013.01);
Abstract

An electronic device and associated methods are disclosed. In one example, the electronic device includes an article having a substrate, a semiconductor die thereon, a routing carrier attached to the substrate, and a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier. In selected examples, the article is made by manufacturing a substrate, attaching a semiconductor die to the substrate, fabricating a routing carrier comprising a transmission pathway, and integrating the routing carrier into the substrate.


Find Patent Forward Citations

Loading…