The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Sep. 21, 2020
Zhuhai Access Semiconductor Co., Ltd, Zhuhai, CN;
Xianming Chen, Zhuhai, CN;
Wenshi Wang, Zhuhai, CN;
Weiyuan Yang, Zhuhai, CN;
Minxiong Li, Zhuhai, CN;
Benxia Huang, Zhuhai, CN;
Lei Feng, Zhuhai, CN;
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD, Zhuhai, CN;
Abstract
An embedded packaging method capable of realizing heat dissipation, includes: providing a frame having at least one through hole; attaching a tape on the first surface and placing a device in the through hole; completely filling the through hole with photosensitive insulating material, and completely curing the photosensitive insulating material in a lower portion of the through hole while not completely curing the photosensitive insulating material in an upper portion of the through hole and covered on the second surface; electroplating on the first surface to form a first metal layer, and electroplating on the upper surface and a side surface of the device, an upper surface of the photosensitive insulating material and an upper end face of each of the first copper pillars to form a second metal layer; and etching to obtain a first circuit layer and a second circuit layer, respectively.