The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2021

Filed:

Aug. 22, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Byeung Chul Kim, Boise, ID (US);

Francois H Fabreguette, Boise, ID (US);

Richard J. Hill, Boise, ID (US);

Shyam Surthi, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01); H01L 21/28 (2006.01); H01L 29/788 (2006.01); H01L 21/02 (2006.01); H01L 29/792 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02236 (2013.01); H01L 27/11556 (2013.01); H01L 29/40114 (2019.08); H01L 29/40117 (2019.08); H01L 29/4991 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/7883 (2013.01); H01L 29/792 (2013.01);
Abstract

Some embodiments include a NAND memory array having a vertical stack of alternating insulative levels and conductive levels. The conductive levels include control gate regions and include second regions proximate to the control gate regions. High-k dielectric structures are directly against the control gate regions and extend entirely across the insulative levels. Charge-blocking material is adjacent to the high-k dielectric structures. Charge-storage material is adjacent to the charge-blocking material. The charge-storage material is configured as segments which are vertically stacked one atop another, and which are vertically spaced from one another. Gate-dielectric material is adjacent to the charge-storage material. Channel material extends vertically along the stack and is adjacent to the gate-dielectric material. Some embodiments include integrated assemblies, and methods of forming integrated assemblies.


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