The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2021

Filed:

Sep. 09, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Johanna Swan, Scottsdale, AZ (US);

Henning Braunisch, Phoenix, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Shawna Liff, Scottsdale, AZ (US);

Brandon Rawlings, Chandler, AZ (US);

Veronica Strong, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G03F 1/38 (2012.01); G03F 1/54 (2012.01); G03F 1/68 (2012.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G03F 1/38 (2013.01); G03F 1/54 (2013.01); G03F 1/68 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01);
Abstract

An lithographic reticle may be formed comprising a transparent substrate, a substantially opaque mask formed on the transparent substrate that defines at least one exposure window, wherein the at least one exposure window has a first end, a first filter formed on the transparent substrate within the at least one exposure window and abutting the first end thereof, and a second filter formed on the transparent substrate within the at least one exposure window and abutting the first filter, wherein an average transmissivity of the first filter is substantially one half of a transmissivity of the second filter. In another embodiment, the at least one exposure window includes a third filter abutting the second end and is adjacent the second filter. Further embodiments of the present description include interconnection structures and systems fabricated using the lithographic reticle.


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