The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Dec. 20, 2017
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Kensaku Igarashi, Nishigo-mura, JP;
Tatsuo Abe, Shirakawa, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
Abstract
A method for cleaning a semiconductor wafer, including: supplying a semiconductor wafer whose surface has an oxide film formed thereon with a cleaning solution capable of removing the oxide film; and cleaning, while rotating, the semiconductor wafer to remove the oxide film formed on the surface of the semiconductor wafer. The oxide film is removed such that a rotational speed of the semiconductor wafer is 300 rpm or more after the cleaning with the cleaning solution is started and before a water-repelling surface is attained, and then the rotational speed of the semiconductor wafer is changed to 100 rpm or less to completely remove the oxide film. A method for cleaning a semiconductor wafer by which both surface roughness improvement and surface defect suppression can be achieved.