The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Aug. 03, 2020
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd, Hsinchu, TW;
Inventors:
Peng-Ren Chen, Hsinchu, TW;
Shiang-Bau Wang, Pingzchen, TW;
Wen-Hao Cheng, Hsinchu, TW;
Yung-Jung Chang, Cyonglin Township, TW;
Wei-Chung Hu, Hsinchu, TW;
Yi-An Huang, Hsinchu, TW;
Jyun-Hong Chen, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06K 9/62 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/6204 (2013.01); G06K 2209/19 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01);
Abstract
A method includes capturing a raw image from a semiconductor wafer, using graphic data system (GDS) information corresponding to the wafer to assign a measurement box in the raw image, performing a distance measurement on a feature of the raw image in the measurement box, and performing a manufacturing activity based on the distance measurement.