The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Jan. 22, 2019
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Yang-Che Chen, Hsin-Chu, TW;
Wei-Yu Chou, Taichung, TW;
Hong-Seng Shue, Hsinchu County, TW;
Chen-Hua Lin, Yunlin County, TW;
Huang-Wen Tseng, Hsinchu County, TW;
Victor Chiang Liang, Hsinchu, TW;
Chwen-Ming Liu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a substrate including a circuit region and an outer border, a plurality of detecting devices disposed over the substrate and located between the circuit region and the outer border, first and second probe pads electrically connected to two ends of each detecting device, and a seal ring located between the outer border of the substrate and the detecting devices. A method for detecting defects in a semiconductor device includes singulating a die having a substrate, a plurality of detecting devices, a first probe pad and a second probe pad electrically connected to two ends of each detecting device, and a seal ring; probing the first and the second probe pads to determine a connection status of the detecting devices; and recognizing a defect when the connection status of the detecting devices indicates an open circuit.