The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Nov. 13, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Kam-Tou Sio, Zhubei, TW;
Chih-Ming Lai, Hsinchu, TW;
Chun-Kuang Chen, Guanxi Township, TW;
Chih-Liang Chen, Hsinchu, TW;
Charles Chew-Yuen Young, Cupertino, CA (US);
Chi-Yeh Yu, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsin Chu, TW;
Ru-Gun Liu, Zhubei, TW;
Wen-Hao Chen, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first conductive interconnect wire extending in a first direction over a substrate. A second conductive interconnect wire is arranged over the first conductive interconnect wire. A via rail is configured to electrically couple the first conductive interconnect wire and the second conductive interconnect wire. The first conductive interconnect wire and the second conductive interconnect wire extend as continuous structures past one or more sides of the via rail.