The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Jan. 08, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Koukichi Hiroshiro, Kumamoto, JP;

Rintaro Higuchi, Kumamoto, JP;

Koji Kagawa, Kumamoto, JP;

Kenji Sekiguchi, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/67 (2006.01); B82Y 40/00 (2011.01); C23C 16/04 (2006.01); G03F 7/16 (2006.01); H01L 21/302 (2006.01); B82Y 30/00 (2011.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C23C 16/04 (2013.01); G03F 7/165 (2013.01); H01L 21/0201 (2013.01); H01L 21/02057 (2013.01); H01L 21/02071 (2013.01); H01L 21/02107 (2013.01); H01L 21/302 (2013.01); H01L 21/321 (2013.01); H01L 21/6704 (2013.01); H01L 21/6708 (2013.01); H01L 21/67011 (2013.01); H01L 21/67023 (2013.01); H01L 21/67028 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01);
Abstract

A substrate processing method includes: maintaining an atmosphere in contact with at least a surface of a substrate on which a first material that is a metal and a second material that is a material other than the first material are exposed, as a deoxidized atmosphere; supplying a film forming material, which selectively forms a film on the first material among the first material and the second material, to the surface of the substrate in a state where the deoxidized atmosphere is maintained by the maintaining; performing a surface treatment of the second material in a state where the film is formed on a surface of the first material supplied in the supplying the film forming material; and removing the film from the surface of the first material after the performing the surface treatment.


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