The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Sep. 28, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Anton J. deVilliers, Clifton Park, NY (US);

Mirko Vukovic, Slingerlands, NY (US);

Brandon Byrns, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H05H 1/46 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32825 (2013.01); H01J 37/3244 (2013.01); H01J 37/32183 (2013.01); H01J 37/32541 (2013.01); H01J 37/32715 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/68764 (2013.01); H05H 1/46 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/334 (2013.01); H05H 2001/4682 (2013.01);
Abstract

Systems and related methods are disclosed for atmospheric plasma processing of microelectronic workpieces, such as semiconductor wafers. For disclosed embodiments, a radio frequency (RF) generator generates an RF signal that is distributed to one or more plasma sources within a process chamber. The process chamber has an atmospheric pressure between 350 to 4000 Torr. The plasma sources are then scanned across a microelectronic workpiece to apply plasma gasses generated by the plasma generators to the microelectronic workpiece. The plasma sources can be individually scanned and/or combined in arrays for scanning across the microelectronic workpiece. Linear and/or angular movement can be applied to the plasma sources and/or the microelectronic workpiece to provide the scanning operation. Various implementations are disclosed.


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