The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
May. 15, 2018
Applied Materials, Inc., Santa Clara, CA (US);
Eswaranand Venkatasubramanian, Santa Clara, CA (US);
Samuel E. Gottheim, Santa Clara, CA (US);
Yang Yang, San Diego, CA (US);
Pramit Manna, Sunnyvale, CA (US);
Kartik Ramaswamy, San Jose, CA (US);
Takehito Koshizawa, San Jose, CA (US);
Abhijit Basu Mallick, Fremont, CA (US);
Srinivas Gandikota, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of high-density films for patterning applications. In one implementation, a method of processing a substrate is provided. The method includes flowing a hydrocarbon-containing gas mixture into a processing volume of a process chamber having a substrate positioned on an electrostatic chuck. The substrate is maintained at a pressure between about 0.5 mTorr and about 10 Torr. The method further includes generating a plasma at the substrate level by applying a first RF bias to the electrostatic chuck to deposit a diamond-like carbon film on the substrate. The diamond-like carbon film has a density greater than 1.8 g/cc and a stress less than −500 MPa.