The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jan. 09, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Victor Chiang Liang, Hsinchu, TW;

Fu-Huan Tsai, Kaohsiung, TW;

Fang-Ting Kuo, Zhubei, TW;

Meng-Chang Ho, Hsinchu, TW;

Yu-Lin Wei, Taichung, TW;

Chi-Feng Huang, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 29/66 (2006.01); H01L 27/07 (2006.01); H01L 29/93 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14603 (2013.01); H01L 27/0733 (2013.01); H01L 27/1463 (2013.01); H01L 27/14614 (2013.01); H01L 27/14689 (2013.01); H01L 29/66174 (2013.01); H01L 29/93 (2013.01);
Abstract

A method of making a semiconductor device includes etching a substrate to define a trench in a substrate, wherein the trench is adjacent to an active region in the substrate, and etching the substrate includes patterning a mask. The method further includes partially removing the mask to expose a first portion of the active region, wherein the first portion extends a first distance from the trench. The method further includes depositing a dielectric material to fill the trench and cover the first portion of the active region. The method further includes removing the mask, wherein the removing of the mask includes maintaining the dielectric material covering the first portion of the active region. The method further includes forming a gate structure over the active region and over the dielectric material.


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