The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Nov. 13, 2018
Applicant:

Dongjin Semichem Co., Ltd., Incheon, KR;

Inventors:

Hye Jung Park, Gyeonggi-do, KR;

Jae Hyun Kim, Seoul, KR;

Jong Dai Park, Seoul, KR;

Min Gun Lee, Seoul, KR;

Jong Chul Shin, Gyeonggi-do, KR;

Sung Hoon Jin, Gyeonggi-do, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/3105 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1436 (2013.01); H01L 21/304 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01);
Abstract

Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1:0.0005≤()*100≤4.5,  [Equation 1]


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