The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 16, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sri Chaitra Jyotsna Chavali, Chandler, AZ (US);

Amruthavalli Pallavi Alur, Tempe, AZ (US);

Wei-Lun Kane Jen, Chandler, AZ (US);

Sriram Srinivasan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/04 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0097 (2013.01); H05K 1/115 (2013.01); H05K 3/007 (2013.01); H05K 3/0023 (2013.01); H05K 3/0047 (2013.01); H05K 3/0055 (2013.01); H05K 3/421 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/025 (2013.01);
Abstract

An asymmetric electronic substrate and method of making the substrate includes forming a first layer on each opposing major surface of a removable carrier layer, the first layer being a routing layer, simultaneously laminating the first layers, and building up subsequent layers on layers previously formed and laminated on the removable carrier layer iteratively. The subsequent layers including routing layers and a core layer formed on each side of the removable carrier layer, the core layer including through holes having a larger gauge than through holes included in the routing layers. A number of layers on a first side of the core layer, between the core layer and the carrier layer, is different than a number of layers on a second side of the core layer. The carrier layer is removed to produce two asymmetric substrates, each asymmetric substrate including one of the at least one core layers.


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