The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Sep. 30, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sansaptak Dasgupta, Hillsboro, OR (US);

Marko Radosavljevic, Portland, OR (US);

Han Wui Then, Portland, OR (US);

Bruce A. Block, Portland, OR (US);

Paul B. Fischer, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/58 (2006.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H03H 9/02015 (2013.01); H03H 9/587 (2013.01); H03H 9/589 (2013.01); H03H 2003/021 (2013.01); H03H 2003/025 (2013.01);
Abstract

Techniques are disclosed for forming integrated circuit single-flipped resonator devices that include an electrode formed of a two-dimensional electron gas (2DEG). The disclosed resonator devices may be implemented with various group III-nitride (III-N) materials, and in some cases, the 2DEG may be formed at a heterojunction of two epitaxial layers each formed of III-N materials, such as a gallium nitride (GaN) layer and an aluminum nitride (AlN) layer. The 2DEG electrode may be able to achieve similar or increased carrier transport as compared to a resonator device having an electrode formed of metal. Additionally, in some embodiments where AlN is used as the piezoelectric material for the resonator device, the AlN may be epitaxially grown which may provide increased performance as compared to piezoelectric material that is deposited by traditional sputtering techniques.


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