The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Aug. 06, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chung-Wei Fang, Hsinchu, TW;

Yi Hsun Chiu, Zhubei, TW;

Cho-Han Li, New Taipei, TW;

Yao Fong Dai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); H01L 21/02 (2006.01); C23C 16/455 (2006.01); H01L 21/3105 (2006.01); H01L 21/66 (2006.01); C23C 16/56 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/4412 (2013.01); C23C 16/45502 (2013.01); C23C 16/45565 (2013.01); C23C 16/56 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02216 (2013.01); H01L 21/02274 (2013.01); H01L 21/31053 (2013.01); H01L 22/12 (2013.01);
Abstract

The present disclosure relates to a chemical vapor deposition apparatus and associated methods. In some embodiments, the CVD apparatus has a vacuum chamber and a gas import having a gas import axis through which a process gas is imported into the vacuum chamber and being arranged near an upper region of the vacuum chamber. At least one exhaust port is arranged near a bottom region of the vacuum chamber. The CVD apparatus also has a shower head arranged under the gas import having a plurality of holes formed there through. The shower head redistributes the process gas to form a precursor material with an uneven thickness that matches a remove profile of a subsequent CMP process. As a result, planarity of the formed layer after the CMP process is improved.


Find Patent Forward Citations

Loading…