The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Dec. 31, 2019
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Chung-Liang Chu, Kaohsiung, TW;
Jian-Cheng Chen, New Taipei, TW;
Yu-Ping Wang, Hsinchu, TW;
Yu-Ruei Chen, New Taipei, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 43/02 (2006.01); G11C 11/16 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); G11C 11/161 (2013.01); H01L 27/0207 (2013.01); H01L 27/228 (2013.01);
Abstract
A semiconductor device includes a substrate having an array region defined thereon, a ring of magnetic tunneling junction (MTJ) region surrounding the array region, wherein the ring of MTJ region comprises a first MTJ, and metal interconnect patterns overlapping part of the ring of MTJ region. Preferably, each of the metal interconnect patterns includes a first metal interconnection connected to the first MTJ directly.