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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10957645 B1

PDFFull Text
Date of Patent:
Mar. 23, 2021

Filed:

Sep. 17, 2019

Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yu-Ming Lee, New Taipei, TW;

Chiang-Hao Lee, Changhua County, TW;

Hung-Jui Kuo, Hsinchu, TW;

Ming-Che Ho, Tainan, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/4763 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/02 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/02516 (2013.01); H01L 21/565 (2013.01); H01L 21/76873 (2013.01); H01L 23/3157 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/09 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01);
Abstract

A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a metallization layer and a dielectric layer disposed on the metallization layer. The metallization layer has conductive patterns, where each of the conductive patterns includes crystal grains, the crystal grains each are in a column shape and include a plurality of first banded structures having copper atoms oriented on a (220) lattice plane.

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