The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Sep. 14, 2017
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Premchandra M. Shankar, Fremont, CA (US);
Ashok Varadarajan, Fremont, CA (US);
JuHwan Rha, San Jose, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); G06T 5/50 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06T 5/50 (2013.01); G06T 7/0008 (2013.01); G06T 2207/20221 (2013.01); G06T 2207/20224 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Repeater defects on a wafer can be detected by fusing multiple die images. In an instance, multiple die images are statistically fused to form a die-fused image. Each of the die images can be of a different die on a wafer. A presence of a repeater defect is detected in the die-fused image. The die images can be generated using a laser-scanning system or other systems.