The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Sep. 30, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Walid M. Hafez, Portland, OR (US);

Roman W. Olac-Vaw, Hillsboro, OR (US);

Chia-Hong Jan, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 21/768 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 27/088 (2006.01); H01L 23/48 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/76895 (2013.01); H01L 21/823431 (2013.01); H01L 21/823462 (2013.01); H01L 21/823481 (2013.01); H01L 21/823821 (2013.01); H01L 21/823857 (2013.01); H01L 21/823871 (2013.01); H01L 21/823878 (2013.01); H01L 23/481 (2013.01); H01L 27/0886 (2013.01); H01L 29/06 (2013.01); H01L 29/0649 (2013.01); H01L 29/417 (2013.01); H01L 29/66 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/78 (2013.01); H01L 29/785 (2013.01); H01L 21/823475 (2013.01);
Abstract

Dual fin endcaps for self-aligned gate edge architectures, and methods of fabricating dual fin endcaps for self-aligned gate edge architectures, are described. In an example, a semiconductor structure includes an I/O device having a first plurality of semiconductor fins disposed above a substrate and protruding through an uppermost surface of a trench isolation layer. A logic device having a second plurality of semiconductor fins is disposed above the substrate and protrudes through the uppermost surface of the trench isolation layer. A gate edge isolation structure is disposed between the I/O device and the logic device. A semiconductor fin of the first plurality of semiconductor fins closest to the gate edge isolation structure is spaced farther from the gate edge isolation structure than a semiconductor fin of the second plurality of semiconductor fins closest to the gate edge isolation structure.


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