The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Sep. 27, 2016
Intel Corporation, Santa Clara, CA (US);
Bok Eng Cheah, Bukit Gambir, MY;
Min Suet Lim, Simpang Ampat, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Howe Yin Loo, Sungai Petani, MY;
Bok Eng Cheah, Bukit Gambir, MY;
Min Suet Lim, Simpang Ampat, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Howe Yin Loo, Sungai Petani, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated.