The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Nov. 13, 2019
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

John Christopher Arnold, North Chatham, NY (US);

Sean D. Burns, Hopewell Junction, NY (US);

Yann Alain Marcel Mignot, Slingerlands, NY (US);

Yongan Xu, Albany, NY (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/31 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/0217 (2013.01); H01L 21/0276 (2013.01); H01L 21/02123 (2013.01); H01L 21/02186 (2013.01); H01L 21/0332 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/3086 (2013.01); H01L 21/30604 (2013.01); H01L 21/30621 (2013.01); H01L 21/31 (2013.01); H01L 21/31116 (2013.01); H01L 21/31122 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/76816 (2013.01);
Abstract

Selective gas etching for self-aligned pattern transfer uses a first block and a separate second block formed in a sacrificial layer to transfer critical dimensions to a desired final layer using a selective gas etching process. The first block is a first hardmask material that can be plasma etched using a first gas, and the second block is a second hardmask material that can be plasma etched using a second gas separate from the first gas. The first hardmask material is not plasma etched using the second gas, and the second hardmask material is not plasma etched using the first gas.


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