The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jul. 31, 2018
Applicants:
Applied Materials, Inc., Santa Clara, CA (US);
Applied Materials Israel Ltd., Rehovot, IL;
Inventors:
Assignees:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
APPLIED MATERIALS ISRAEL LTD., Rehovot, IL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/11 (2017.01); H01J 37/22 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06T 7/11 (2017.01); H01J 37/222 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/221 (2013.01); H01J 2237/2804 (2013.01); H01J 2237/2817 (2013.01);
Abstract
A method for detecting voids in a metal line of a semiconductor device die includes: scanning an electron beam upon a selected location on the die containing the metal line; determine gray levels in an image produced by collected electrons of the electron beam backscattered from the selected location on the die; and identifying one or more voids in the metal line based on differences between the gray levels in the image.