The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Sep. 18, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yu-Kuang Liao, Hsinchu, TW;
Cheng-Chun Tsai, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Fang-Cheng Chen, Hsin-chu, TW;
Wen-Chih Chiou, Miaoli County, TW;
Ping-Jung Wu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/125 (2006.01); G02B 6/42 (2006.01); G02B 6/122 (2006.01); G02B 6/43 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G02B 6/125 (2013.01); G02B 6/122 (2013.01); G02B 6/4201 (2013.01); G02B 6/4274 (2013.01); G02B 6/43 (2013.01); H01L 23/5226 (2013.01);
Abstract
A package structure including a plurality of first dies and an insulating encapsulant is provided. The plurality of first dies each include a first waveguide layer having a first waveguide path of a bent pattern, wherein the first waveguide layers of the plurality of first dies are optically coupled to each other to form an optical route. The insulating encapsulant encapsulates the plurality of first dies.