The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2021

Filed:

Dec. 23, 2019
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Andrew C. Lee, Daly City, CA (US);

Michael C. Kellogg, San Francisco, CA (US);

Christopher J. Pena, Hayward, CA (US);

John Edward Daugherty, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/44 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C23C 16/45525 (2013.01); B24B 37/042 (2013.01); C23C 16/042 (2013.01); C23C 16/045 (2013.01); C23C 16/4402 (2013.01); C23C 16/4404 (2013.01); C23C 16/4409 (2013.01); C23C 16/45561 (2013.01);
Abstract

A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.


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