The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Jul. 03, 2018
Asml Netherlands B.v., Veldhoven, NL;
Marc Johannes Noot, Eindhoven, NL;
Simon Gijsbert Josephus Mathijssen, Rosmalen, NL;
Kaustuve Bhattacharyya, Veldhoven, NL;
Jinmoo Byun, Seoul, KR;
Hyun-Su Kim, Seong-Nam, KR;
Won-Jae Jang, Gyeonggi-do, KR;
Timothy Dugan Davis, Portland, OR (US);
ASML Netherlands B.V., Veldhoven, NL;
Abstract
Disclosed are a method, computer program and a metrology apparatus for measuring a process effect parameter relating to a manufacturing process for manufacturing integrated circuits on a substrate. The method comprises determining for a structure, a first quality metric value for a quality metric from a plurality of measurement values each relating to a different measurement condition while cancelling or mitigating for the effect of the process effect parameter on the plurality of measurement values and a second quality metric value for the quality metric from at least one measurement value relating to at least one measurement condition without cancelling or mitigating for the effect of the process effect parameter on the at least one measurement value. The process effect parameter value for the process effect parameter can then be calculated from the first quality metric value and the second quality metric value, for example by calculating their difference.