The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Apr. 18, 2019
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chien-Hua Chen, Kaohsiung, TW;
Sheng-Chi Hsieh, Kaohsiung, TW;
Chen-Chao Wang, Kaohsiung, TW;
Teck-Chong Lee, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a first glass carrier, a package body, a first circuit layer and a first antenna layer. The first circuit layer is disposed on the first surface of the first glass carrier. The first circuit layer has a redistribution layer (RDL). The package body is disposed on the first circuit layer. The package body has an interconnection structure penetrating the package body and is electrically connected to the RDL of the first circuit layer. The first antenna layer is disposed on the second surface of the first glass carrier.