The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Nov. 13, 2018
Applicant:
Kla-tencor Corporation, Milpitas, CA;
Inventors:
Erfan Soltanmohammadi, Felton, CA (US);
Martin Plihal, Pleasanton, CA (US);
Tai-Kam Ng, San Jose, CA (US);
Sang Hyun Lee, Clifton Park, NY (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06N 3/08 (2006.01); G06N 3/04 (2006.01); G06K 9/62 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G06K 9/626 (2013.01); G06K 9/628 (2013.01); G06N 3/04 (2013.01); G06N 3/08 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Defects of interest can be captured by a classifier. Images of a semiconductor wafer can be received at a deep learning classification module. These images can be sorted into soft decisions with the deep learning classification module. A class of the defect of interest for an image can be determined from the soft decisions. The deep learning classification module can be in electronic communication with an optical inspection system or other types of semiconductor inspection systems.