The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Jul. 10, 2019
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Ramasamy Chockalingam, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Ian Melville, Highland, NY (US);
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Abstract
The disclosed subject matter relates to a structure and method to improve bond pad reliability of semiconductor devices. According to an aspect of the present disclosure, a bond pad structure is provided that includes a dielectric layer and at least one bond pad in the dielectric layer, wherein the bond pad has a top surface. A passivation layer has an opening over the bond pad, wherein the opening has sidewalls. A low-k barrier layer is covering the sidewalls of the opening and the top surface of the bond pad. Protective structures are formed over the sidewalls of the opening.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile