The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
May. 25, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Jing-Cheng Lin, Hsinchu, TW;
Li-Hui Cheng, New Taipei, TW;
Po-Hao Tsai, Taoyuan County, TW;
Jeh-Yin Chang, Hsinchu, TW;
Li-Chung Kuo, Taipei, TW;
Hsien-Ju Tsou, Taipei, TW;
Yi Chou, New Taipei, TW;
Ying-Ching Shih, Hsinchu, TW;
Szu-Wei Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device package includes a substrate, a semiconductor chip, a first ring structure and a second ring structure. The substrate includes a surface. The semiconductor chip is over the surface of the substrate. The first ring structure is over the surface of the substrate. The second ring structure is over the surface of the substrate, wherein the first ring structure is between the semiconductor chip and the second ring structure.