The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

May. 10, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hung-Li Chiang, Taipei, TW;

I-Sheng Chen, Taipei, TW;

Tzu-Chiang Chen, Hsinchu, TW;

Tung-Ying Lee, Hsinchu, TW;

Szu-Wei Huang, Hsinchu, TW;

Huan-Sheng Wei, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823807 (2013.01); H01L 21/02603 (2013.01); H01L 21/02609 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823878 (2013.01); H01L 27/092 (2013.01); H01L 29/0653 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01); H01L 29/045 (2013.01);
Abstract

Semiconductor device structures are provided. The semiconductor device structure includes first semiconductor wires over a semiconductor substrate. The first semiconductor wires are vertically spaced apart from each other. The semiconductor device structure also includes a gate stack surrounding first portions of the first semiconductor wires, and a spacer element surrounding second portions of the first semiconductor wires. The first portions have a first width and the second portions have a second width. In addition, the semiconductor device structure includes a second semiconductor wire between the second portions. The second semiconductor wire has a third width, and the third width is substantially equal to the second width and greater than the first width.


Find Patent Forward Citations

Loading…