The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10879114 B1

Date of Patent:

Dec. 29, 2020

Filed:

Aug. 23, 2019

Conductive fill

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jung-Tang Wu, Kaohsiung, TW;

Chi-Hung Liao, Hsinchu, TW;

Szu-Hua Wu, Zhubei, TW;

Liang-Yueh Ou Yang, New Taipei, TW;

Chin-Szu Lee, Taoyuan, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

S V Clark

Int. Cl.

CPC ...

H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 29/40 (2006.01); H01L 23/532 (2006.01); H01L 29/45 (2006.01);

U.S. Cl.

CPC ...

H01L 21/76856 (2013.01); H01L 21/76873 (2013.01); H01L 23/53209 (2013.01); H01L 29/401 (2013.01); H01L 29/45 (2013.01);

Abstract

A conductive fill is provided in an opening of an interconnect layer. A seed layer is formed, a portion of which is then oxidized. The oxygen is removed in a treatment process and the surface of the de-oxidized seed layer is hydrolyzed to form a hydroxyl sublayer and moisturized. The conductive fill is formed over the hydroxyl sublayer.

Find Patent Forward Citations

Wu, Jung-Tang. (2020). Conductive fill (U.S. Patent No. 10879114). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10879114

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile