The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Aug. 23, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Jung-Tang Wu, Kaohsiung, TW;
Chi-Hung Liao, Hsinchu, TW;
Szu-Hua Wu, Zhubei, TW;
Liang-Yueh Ou Yang, New Taipei, TW;
Chin-Szu Lee, Taoyuan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 29/40 (2006.01); H01L 23/532 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76856 (2013.01); H01L 21/76873 (2013.01); H01L 23/53209 (2013.01); H01L 29/401 (2013.01); H01L 29/45 (2013.01);
Abstract
A conductive fill is provided in an opening of an interconnect layer. A seed layer is formed, a portion of which is then oxidized. The oxygen is removed in a treatment process and the surface of the de-oxidized seed layer is hydrolyzed to form a hydroxyl sublayer and moisturized. The conductive fill is formed over the hydroxyl sublayer.